Layout

Documentation for PSEC3 Flip Chip Mezzanine Card fabrication and assembly.

  1. 2729specification.pdf : Board specification drawing.
  2. 2730assembly_top.pdf : Board assembly drawing - top side.
  3. 2730assembly_bot.pdf : Board assembly drawing - bottom side
  4. Gerber files : The Gerber files used in  board fabrication (zipped).
  5. Plots of the Gerber files in pdf.
  6. 2729_BOM.xls: Bill of Materials - Prototype: Assembly of a full board

 


 
For questions regarding this page contact Mircea Bogdan.
bogdan@ede.uchicago.edu
Revised: March 2011 by Mircea Bogdan